Digital FM Receiver Circuit Board

Digital FM Receiver Circuit Board

Moko, your single point of contact for all of your raw materials, parts, and pcb assembly, also offers: - Contract Manufacturing - Engineering Services - PCB Design & Assembly - Product Design - Prototyping - Cable and Wire Assemblies - Plastics and Molds Quote requirement: 1)Gerber file and...

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Product Details


Moko, your single point of contact for all of your raw materials, parts, and pcb assembly, also offers:

- Contract Manufacturing

- Engineering Services

- PCB Design & Assembly

- Product Design

- Prototyping

- Cable and Wire Assemblies

- Plastics and Molds


Quote requirement:

1)Gerber file and Bom list

2)Clear pics of pcba or pcba sample for us

3)Test method for PCBA


Product Description

1.Detailed Specification of PCB Manufacturing

1

Layer

1-30 layer

2

Material

FR-4,CEM-1,CEM-3,Hight TG,FR4 Halogen Free,FR-1,FR-2,Aluminum

3

Board thickness

0.2mm-7mm

4

Max.finished board side

500mm*500mm

5

Min.drilled hole size

0.25mm

6

Min.line width

0.075mm(3mil)

7

Min.line spaceing

0.075mm(3mil)

8

Surface finish/treatment

HALS/HALS lead free,Chemical tin,Chemical Gold,Immersion gold Inmersion Silver/Gold,Osp,Gold Plating

9

Copper thickness

0.5-4.0oz

10

Solder mask color

green/black/white/red/blue/yellow

11

Inner packing

Vacuum packing,Plastic bag

12

Outer packing

Standard carton packing

13

Hole tolerance

PTH:±0.076,NTPH:±0.05

14

Certificate

UL,ISO9001,ISO14001,ROHS,CQC

15

Profiling Punching

Routing,V-CUT,Beveling

16

Assembly Service

Providing OEM service to all sorts of printed circuit board assembly


2.Detailed Terms for Pcb Assembly

Technical requirement:

1) Professional Surface-mounting and Through-hole soldering Technology

2) Various sizes like 1206,0805,0603 components SMT technology

3) ICT(In Circuit Test),FCT(Functional Circuit Test) technology.

4) PCB Assembly With UL,CE,FCC,Rohs Approval

5) Nitrogen gas reflow soldering technology for SMT.

6) High Standard SMT&Solder Assembly Line

7) High density interconnected board placement technology capacity.


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