Digital FM Receiver Circuit Board Assembly Production

Digital FM Receiver Circuit Board Assembly Production

Moko, your single point of contact for all of your raw materials, parts, and pcb assembly, also offers: - Contract Manufacturing - Engineering Services - PCB Design & Assembly - Product Design - Prototyping - Cable and Wire Assemblies - Plastics and Molds Quote requirement: 1)Gerber file and...

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Product Details

 

Moko, your single point of contact for all of your raw materials, parts, and pcb assembly, also offers:

- Contract Manufacturing

- Engineering Services

- PCB Design & Assembly

- Product Design

- Prototyping

- Cable and Wire Assemblies

- Plastics and Molds

 

Quote requirement:

1)Gerber file and Bom list

2)Clear pics of pcba or pcba sample for us

3)Test method for PCBA

 

Product Description

1.Detailed Specification of PCB Manufacturing

1 Layer 1-30 layer
2 Material FR-4,CEM-1,CEM-3,Hight TG,FR4 Halogen Free,FR-1,FR-2,Aluminum
3 Board thickness 0.2mm-7mm
4 Max.finished board side 500mm*500mm
5 Min.drilled hole size 0.25mm
6 Min.line width 0.075mm(3mil)
7 Min.line spaceing 0.075mm(3mil)
8 Surface finish/treatment HALS/HALS lead free,Chemical tin,Chemical Gold,Immersion gold Inmersion Silver/Gold,Osp,Gold Plating
9 Copper thickness 0.5-4.0oz
10 Solder mask color green/black/white/red/blue/yellow
11 Inner packing Vacuum packing,Plastic bag
12 Outer packing Standard carton packing
13 Hole tolerance PTH:±0.076,NTPH:±0.05
14 Certificate UL,ISO9001,ISO14001,ROHS,CQC
15 Profiling Punching Routing,V-CUT,Beveling
16 Assembly Service Providing OEM service to all sorts of printed circuit board assembly

 

2.Detailed Terms for Pcb Assembly

Technical requirement:

1) Professional Surface-mounting and Through-hole soldering Technology

2) Various sizes like 1206,0805,0603 components SMT technology

3) ICT(In Circuit Test),FCT(Functional Circuit Test) technology.

4) PCB Assembly With UL,CE,FCC,Rohs Approval

5) Nitrogen gas reflow soldering technology for SMT.

6) High Standard SMT&Solder Assembly Line

7) High density interconnected board placement technology capacity.


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