Printed Circuit Board Design

Printed Circuit Board Design

The surface mount process used in this Printed Circuit Board Design stands out in terms of manufacturing efficiency because of its fully automated PCB assembly process from solder paste printing, pick and place and reflow soldering. It applies solder paste to the board by a solder paste printer during solder paste printing.

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Product Details

Product description:

The surface mount process used in this Printed Circuit Board Design stands out in terms of manufacturing efficiency because of its fully automated PCB assembly process from solder paste printing, pick and place and reflow soldering. It applies solder paste to the board by a solder paste printer during solder paste printing. The stencil ensures that the solder paste can be accurately placed in the correct position of the mounting component, also known as a stencil or soldering screen. We usually check this product after solder paste printing by the solder paste inspector. This inspection ensures that printing has met regulations and standards. If a defect is found in the solder paste printing, the printing must be repeated or the solder paste must be washed off before the second printing. When the Printed Circuit Board Design comes out of the solder paste press, the PCB is automatically sent to the placement machine where the components or ICs are mounted on the appropriate pads to resist solder paste tension. The components are mounted on the PCB by component spools in the machine. Similar to a film reel, the component reel of the load bearing assembly rotates to provide parts to the machine, which will quickly adhere the part to the product. This Printed Circuit Board Design is then reflow soldered. After placing each component, the board passes through the furnace. A temperature of 500 °F causes the solder paste to liquefy. SMD components are now firmly tied to the board.

Product specifications:

Number of Layers: Multilayer

Base Material: FR-4

Copper Thickness: 1oz

Board Thickness: 1.6mm

Min. Hole Size: 4mil

Min. Line Width: 4mil

Min. Line Spacing: 4mil

Surface Finishing: ENIG(Immersion Gold)

Legend: White

Solder Mask: Green,Red,Black,Yellow,Blue,Orange,Purple

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