FR4 Printed Circuit Card Assembly

FR4 Printed Circuit Card Assembly

The last layer of all layers of this FR4 Printed Circuit Card Assembly, the substrate, is made of fiberglass, also known as FR4, and the FR letter stands for "flame retardant". The base layer provides a solid foundation for the PCB, but the thickness can vary depending on the application of the given board. The second layer of this product is copper, which is laminated to the substrate by a mixture of heat and adhesive.

Product Details

Product description:

The last layer of all layers of this FR4 Printed Circuit Card Assembly, the substrate, is made of fiberglass, also known as FR4, and the FR letter stands for "flame retardant". The base layer provides a solid foundation for the PCB, but the thickness can vary depending on the application of the given board. The second layer of this product is copper, which is laminated to the substrate by a mixture of heat and adhesive. The copper layer is very thin and there are two such layers on some of the plates: one above the substrate and one below the substrate. Its extensive use of copper clad laminates can be divided into different categories, including reinforcement materials, resin binders used, and flammability. The green solder mask on top of this FR4 Printed Circuit Card Assembly is a wire mesh layer with alpha and numeric indicators that make the PCB available to technical programmers. This, in turn, makes it easier for the electronics assembler to place each PCB in the proper position and in the correct orientation on each component. The mesh layer of this FR4 Printed Circuit Card Assembly is usually white, but sometimes colors such as red, yellow, gray and black are also used.

Product specifications:

Place of Origin: Guangdong, China (Mainland) 

Brand Name: OEM 

Model Number: MK-PCB-990J160 

Base Material: FR4 

Copper Thickness: 1OZ 

Board Thickness: 1.6mm 

Min. Hole Size: 0.25mm 

Min. Line Width: 0.075mm(3 mil) 

Min. Line Spacing: 0.075mm(3 mil) 

Surface Finishing: HASL 

Max Panel size:: 800*508mm 

Board finished thickness:: 0.2-4.0mm 

Tolerance of finished panel thickness:: ±10% 

Surface Treating Process of Inner layer:: Brown Oxide 

Layer Count:: 1-18 

Impedence control and tolerance:: 50O±10% 

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