HDI PCB, High Density Interconnect PCB, HDI PCB Manufacturing

HDI PCB, High Density Interconnect PCB, HDI PCB Manufacturing

High Density Interconnects (HDI) are used to meet the market demand for complex designs in smaller form factors across the majority of market segments, (Wireless, Telecom, Military, Medical, Semiconductor, and Instrumentation). HDI Circuit boards, one of the fastest growing technologies in PCBs,...

Chat Now

Product Details

High Density Interconnects (HDI) are used to meet the market demand for complex designs in smaller form factors across the majority of market segments, (Wireless, Telecom, Military, Medical, Semiconductor, and Instrumentation).

HDI Circuit boards, one of the fastest growing technologies in PCBs, HDI Boards contain blind and/or buried vias and often contain microvias of .006 or less in diameter.

They have finer lines and spaces always = <3mil They have a higher circuitry density than traditional circuit boards.

MOKO maintains years of experience with HDI products and was a pioneer of second generation microvias. now offer an entire family of microvia technology solutions for your next generation products.

HDI Board General Information

High Density Interconnects (HDI) board are defined as a board (PCB) with

a higher wiring density per unit area than conventional printed circuit boards (PCB).

They have finer lines and spaces (<100 µm), smaller vias (<150 µm) and capture pads (<400 µm), I/O>300,
  and higher connection pad density (>20 pads/cm2) than employed in conventional PCB technology.


HDI board is used to reduce size and weight, as well as to enhance electrical performance.

According to layer up different, currently DHI board is divided into three basic types:

1) HDI PCB (1+N+1)

HDI PCB, High Density Interconnect PCB Features:

Suitable for BGA with lower I/O counts

Fine line, microvia and registration technologies capable of 0.4 mm ball pitch
Qualified material and surface treatment for Lead-free process

Excellent mounting stability and reliability

Copper filled via

HDI PCB, High Density Interconnect PCB Application:
Cell phone, UMPC, MP3 Player, PMP, GPS, Memory Card


1+N+1 HDI PCB Structure:

2) HDI PCB (2+N+2)

HDI PCB, High Density Interconnect PCB Features:

Suitable for BGA with smaller ball pitch and higher I/O counts

Increase routing density in complicated design

Thin board capabilities

Lower Dk / Df material enables better signal transmission performance

Copper filled via

HDI PCB, High Density Interconnect PCB Application:

Cell phone, PDA, UMPC, Portable game console, DSC, Camcorder

HDI PCB Capabilities

Please contact us for more information about HDI PCB Board.

Previous:Heavy Copper PCB, Heavy Copper PCB Manufacturer Next:Double Sided PCB, Double Sided Aluminum PCB

Inquiry