High Density Interconnects (HDI) are used to meet the market demand for complex designs in smaller form factors across the majority of market segments, (Wireless, Telecom, Military, Medical, Semiconductor, and Instrumentation).
They have finer lines and spaces always = <3mil They have a higher circuitry density than traditional circuit boards.
MOKO maintains years of experience with HDI products and was a
pioneer of second generation microvias. now offer an entire family of
microvia technology solutions for your next generation products
High Density Interconnect PCB Application:
Portable game console
HDI PCB Capabilities
Item Capabilities Layers 3 - 50 Layers HDI Step 3+N+3 Min.Line Width 0.05mm (2 mil) Min.Line Space 0.05mm (2 mil) Min.Annular ring 0.1mm (4 mil) Min. Via 0.1mm (4 mil) Max.Size 500mm X 800mm Material FR4,High Tg220 Material thickness Start at 25um Plus copper Copper thickness 0.3 OZ to 10 OZ (10um - 350um)