LED Power PCB Assembly Boards include front copper foil, back copper foil and a plurality of through holes. The front copper foil includes pads and traces, and also includes heat-dissipating copper foil insulated from the pads and traces. A rivet-shaped, thermally conductive copper colloid that passes through the plate and communicates with the heat-dissipating copper foil and the back copper foil.
LED Power PCB Assembly Boards utilizes the excellent thermal conductivity of copper glue to introduce the heat generated by the LED into the back heat-dissipating copper foil, thereby providing heat dissipation. It overcomes the shortcomings of the prior art aluminum-based materials that only dissipate heat and not conduct heat. The heat dissipation effect of the LED printed circuit board. It is suitable for continuous production with molds, the die life of the mold can be increased, the production efficiency is improved, and the molding processing cost of the LED printed circuit board is reduced.
Base metals in the MCPCB are used as an alternative to FR4 or CEM3 boards for the ability to dissipate heat away from critical board components and to less crucial areas such as the metal heatsink backing or metallic core.
- Outdoor & Indoor architectural lighting
- Decorative lighting
- Flood lighting,cast light lamps
- Street lamp,Tunnel lamp