PCB, the Chinese name for the printed circuit board, also known as printed circuit boards, is an important electronic components, is the support of electronic components, electronic components is the carrier of electrical connections. Because it is made using electronic printing, it is called "printed" circuit board.
Printed boards develop from single layer to double sided, multi-layer and flexible, and still maintain their respective development trends. As a result of continuous high-precision, high density and high reliability direction, continue to reduce the size, reduce costs and improve performance, making the PCB in the future development of electronic equipment, still maintained a strong vitality.
This paper focuses on the development of the future development trend of printed circuit board manufacturing technology, that is, to the high density, high precision, fine pore size, fine wire, fine pitch, high reliability, multi-layer, high-speed transmission, Thin direction, in production at the same time to improve productivity, reduce costs and reduce pollution, to adapt to more varieties, small batch production direction. Printed circuit technology development level, generally on the printed circuit board width, aperture, thickness / aperture ratio as the representative.
Printed circuit board is the creator of the Austrian Paul Eisler (Paul Eisler), in 1936, he first used in the radio printed circuit board. In 1943, the United States and many of the technology used in military radio, in 1948, the United States officially recognized the invention can be used for commercial purposes. Since the mid-1950s, printed circuit boards have been widely used.
Before the PCB appeared, the interconnection between the electronic components are based on direct connection to complete the wire. Nowadays, the wires are only used in the laboratory to do experimental applications; printed circuit boards in the electronics industry has certainly occupied the absolute control of the status.
PCB production process:
First, contact manufacturers
First need to contact the manufacturers, and then register the customer number, there will be someone for your offer, orders, and follow the production progress.
Second, open materials
Purpose: According to the requirements of engineering data MI, in accordance with the requirements of large sheets, cut into small pieces of production plate. Meet the customer requirements of small pieces of sheet metal.
Process: large sheet material → according to MI requirements cut board → bar board → beer round corner \ edging → out board
Purpose: According to the engineering data, the required aperture is drilled at the corresponding position on the sheet of the required size.
Process: stacking pin → upper plate → drill hole → lower plate → check \ repair
Four, sink copper
Purpose: Shen copper is the use of chemical methods in the insulation hole wall deposited on a thin layer of copper.
Process: coarse grinding → hanging plate → Shen copper automatic line → plate → dip% dilute H2SO4 → thick copper
Fifth, graphics transfer
Purpose: Graphics transfer is the production of images on the film transferred to the board
Process: (blue oil process): grinding plate → printing the first side → drying → printing the second side → drying → burst light → Chong → check; (dry film process): linen → film → standing → Bit → exposure → standing → punching → check