Multi Layers MCPCB General Info

- Apr 28, 2016 -

Multi Layers MCPCB General Info

Just like FR4 PCB, we can also make boards with more than 2 layers of traces and we named it "Multi Layers MCPCB". The structure is similar with FR4 Multi Layers, but it much more complex to make.

You can populated more components on the boards, put signal and ground layer into seperated layers, to achieve better performance in electrical performance.

Compared with normal FR4, this sturcture need more technology and experience on laminating of more than two layers together with metal core and the cost is much higher than 2 layers MCPCB or double sided MCPCB.

Structure of Multi Layers MCPCB
Multi Layer MCPCB structure


Capability of Multi Layers MCPCB

    Base material: Aluminum/Copper/Iron Alloy
    Thermal Conductivity (dielectrial layer): 0.8, 1.5, 2.0, 3.0 W/m.K.
    Board Thickness: 0.8mm~3.0mm(0.02"~0.12")
    Copper thickness: 0.5 OZ, 1.0 OZ, 2.0 OZ, 3.0 OZ
    Outline: Routing, punching, V-Cut
    Soldermask: White/Black/Blue/Green/Red Oil
    Legend/Silkscreen Color: Black/White
    Surface finishing: Immersion Gold, HASL, OSP
    Max Panel size: 600*500mm(23.62"*19.68")
    Packing: Vacuum/Plastic bag
    Samples L/T: 15~18 Days
    MP L/T: 15~20 Days

Please contact us for more information about the Multi layers MCPCB.

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