Multi Layers MCPCB General Info
Just like FR4 PCB, we can also make boards with more than 2 layers of traces and we named it "Multi Layers MCPCB". The structure is similar with FR4 Multi Layers, but it much more complex to make.
You can populated more components on the boards, put signal and ground layer into seperated layers, to achieve better performance in electrical performance.
Compared with normal FR4, this sturcture need more technology and experience on laminating of more than two layers together with metal core and the cost is much higher than 2 layers MCPCB or double sided MCPCB.
Structure of Multi Layers MCPCB
Multi Layer MCPCB structure
Capability of Multi Layers MCPCB
Base material: Aluminum/Copper/Iron Alloy
Thermal Conductivity (dielectrial layer): 0.8, 1.5, 2.0, 3.0 W/m.K.
Board Thickness: 0.8mm~3.0mm(0.02"~0.12")
Copper thickness: 0.5 OZ, 1.0 OZ, 2.0 OZ, 3.0 OZ
Outline: Routing, punching, V-Cut
Soldermask: White/Black/Blue/Green/Red Oil
Legend/Silkscreen Color: Black/White
Surface finishing: Immersion Gold, HASL, OSP
Max Panel size: 600*500mm(23.62"*19.68")
Packing: Vacuum/Plastic bag
Samples L/T: 15~18 Days
MP L/T: 15~20 Days
Please contact us for more information about the Multi layers MCPCB.